Design and Packaging

Footprint

 

The footprint of the MTi 1-s module is similar to a 28-lead Plastic Leaded Chip Carrier package (JEDEC MO-047). Although it is recommended to solder the MTi 1-s module directly onto a PCB, it can also be mounted in a compatible PLCC socket (e.g. 8428-21B1-RK of M3, as used on the MTi 1-series Development Kit). When using a socket, make sure that it supports the maximum dimensions of the MTi 1-series module as shown under #Package drawing (note the tolerance of ± 0.1 mm).

 

Recommended MTi 1-series module footprint

 

The MTi 1-s module is shipped in trays with 20 or 100 modules or in reels with 250 modules.

 

 

Tray packaging information

 

Tray of 20 pcs (MTi-#-##-T)

 

Tray Dimensions (mm)

Tray packaging information

Pin 1

Length “X”

Width “Y”

Height “Z”

Pocket

X-Pitch

Pocket

Y-Pitch

Pocket

X-Y Array

Qty/Tray

Qty/Box

 

322.60

135.90

7.62

14.65

16.00

12 x 12

20 units

20 units

Detail “A”

Marking

 

NOTES:

 

 

Tray of 100 pcs (MTi-#-##-C)

 

 

Reel packaging information (MTi-#-##-R)

 

Carrier tape (mm)

Reels (mm)

Pin 1

Packing

Ao

Bo

Ko

W

Po

P1

P2

A

N

C

W3

Orientation by quadrant

QTY/

Reel

12.6

-

12.8

12.6

-

12.8

2.9

-

3.10

23.70

-

24.30

3.90

-

4.10

15.90

-

16.10

1.90

-

2.10

177.80

55

12.80

-

13.50

23.90

-

27.40

1 & 2

250

 

NOTES:

 

 

Package drawing

 

All the MTi 1-series module generations have the same board dimensions and footprint, but the component placement can differ between generations.

 

 

MTi 1-series module generations

Version 1.x (PCB no. SM141111)

Version 2.x (PCB no. ≥ SM171223)

 Version 3.x/5.x (PCB no. ≥ SM210527)

MTi 1-series v1.x dimensions and sensor locations

MTi 1-series v2.x dimensions and sensor locations

MTi 1-series v3.x dimensions and sensor locations
  • All dimensions are in mm.
  • General tolerances are ± 0.1 mm
  

 

 

Location PCB number on MTi 1-series module (bottom view)

 

 

 

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