Design and Packaging

• Footprint
• Tray packaging information
  • Tray of 20 pcs (MTi-#-##-T)
  • Tray of 100 pcs (MTi-#-##-C)
• Reel packaging information (MTi-#-##-R)
• Package drawing

Footprint

The footprint of the MTi 1-s module is similar to a 28-lead Plastic Leaded Chip Carrier package (JEDEC MO-047). Although it is recommended to solder the MTi 1-s module directly onto a PCB, it can also be mounted in a compatible PLCC socket (e.g. 8428-21B1-RK of M3, as used on the MTi 1-series Development Kit). When using a socket, make sure that it supports the maximum dimensions of the MTi 1-series module as shown under #Package drawing (note the tolerance of ± 0.1 mm).

Recommended MTi 1-series module footprint

The MTi 1-s module is shipped in trays with 20 or 100 modules or in reels with 250 modules.

Tray packaging information

Tray of 20 pcs (MTi-#-##-T)

NOTES:

• All dimensions are in millimeters.
• Pictured tray representative only, actual tray may look different.
• The hardware version number is labeled SPEC REV on the TNR Label.

Tray of 100 pcs (MTi-#-##-C)

Reel packaging information (MTi-#-##-R)

NOTES:

• All dimensions are in millimeters, unless otherwise specified.
• The hardware version number is labeled SPEC REV on the TNR Label.

Package drawing

All the MTi 1-series module generations have the same board dimensions and footprint, but the component placement can differ between generations.

Location PCB number on MTi 1-series module (bottom view)